With our recent Series C fundraising of $80M, we’ll be scaling operations and expanding our product lines to meet the rapidly growing demand for our AirJet® Solid-State Active Cooling solutions that are unleashing the performance of both Edge AI and Data Center AI platforms.
Our Series C fundraising was led by Fidelity Management & Research Company. Prosperity7 also made a significant investment in the round, together with all existing investors, Mayfield Fund, Clear Ventures, Addition, Qualcomm Ventures, MVP Ventures, Stepstone Group, Alumni Ventures and others. This support reinforces our unique positioning that will enable us to seize the massive opportunities in thermal solutions created by the AI revolution.
With, AirJet® and our new AirJet®PAKs, we’ll be unleashing performance across the massive and growing range of AI platforms:
- Edge AI Gateways at the network's edge to enable faster decision making without relying solely on the cloud
- On-Device Edge AI, including Copilot+ PCs, enabling AI workloads to be run entirely On-Device to maximize privacy, real-time responsiveness, and energy savings
- Data Center AI factories enabling higher compute densities for reduced infrastructure, energy and environmental costs.
Read more about the new AirJet PAKs here.
Applications leveraging AI generate far more heat than today’s devices are designed to handle. AirJet can be integrated into the vast number of devices adopting the latest AI capabilities, ensuring these platforms remain cool and are not forced to throttle performance due to heat. The need for improved cooling to enable AI is increasing rapidly, and with demand for Edge AI Computing estimated to increase by over 300% by 2030, it will not slow down anytime soon.
As Patrick Moorehead, an Industry expert and CEO and Chief Analyst at Moor Insights & Strategy said recently, “Heat is by far the biggest hurdle we need to overcome in computing, and to meet the massive performance increase needed for intense AI workloads. Thermally stressed hardware doesn’t perform optimally, and current thermal solutions fall short. Frore Systems has reinvented thermal technology with its AirJet chip that doubles active heat removal with a thinner, lighter, silent, dustproof and vibration free solution that provides greater performance.”
Heat, which limits performance, is now the single biggest problem facing the computing industry. AirJet’s ability to dissipate heat, unleashing performance, is essential for AI applications.
We’ve been demonstrating our latest AI cooling solutions at recent events, showcasing how AirJet PAK cools up to 100 TOPS of AI workload running on Nvidia Jetson Orin platforms in thin, light, silent, dustproof, and vibration free form factors.
Seshu Madhavapeddy, our founder and CEO, thanked the entire Frore Team at a recent Company All Hands announcing the Series C fundraising, saying “Cooling is critical to enable the performance needed to realize the full promise of AI – today and in the future. It is impossible to remove heat adequately with traditional bulky and noisy thermal solutions like fans. We are thrilled our investors and customers alike, support our vision to scale our AirJet solutions to make devices faster, thinner, lighter, silent, dustproof and vibration free. As you all know, AirJet is critical for companies wanting to adopt the latest AI capabilities into their products. Thank you all for the hard work and commitment to innovation and excellence that has brought us to this major milestone.”
