AirJet^® Mini Slim chip is built on the same revolutionary active cooling design as the AirJet^® Mini - the world’s first solid-state active cooling chip.

AirJet^® Mini Slim removes 5.25 Watts of heat at a silent 21 dBA noise level, while only consuming a maximum of 1 Watt of power. It generates 1750 Pascals of back pressure, 10x higher than a fan, enabling sleek, dustproof devices.

AirJet^® Mini Slim, is the thinnest and most advanced solid-state active cooling chip available, including three new features, while remaining silent, lightweight and delivering superior performance over traditional fans.

What’s new….

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Thinner Design:

At an incredibly thin 2.65mm, AirJet Mini Slim trims an additional 0.15mm from the height of the original AirJet Mini, while maintaining its exceptional heat removal capabilities. This ultra-thin profile opens up new possibilities for manufacturers catering to consumer demand for higher performance in more compact devices. AirJet Mini Slim is an ideal solution for ultra-thin products like fanless laptops, professional tablets, handheld gaming devices, and gaming smartphones.

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Thermoception:

AirJet Mini Slim introduces Thermoception, a capability that enables the chip to independently sense its surrounding temperature. This innovation allows AirJet Mini Slim chip to optimize its performance autonomously, maximizing heat removal without relying on temperature sensors in the host device. This opens new possibilities for micro devices that may lack integrated CPUs or other temperature sensing components.